Dow is back with its 2023/2024 edition of its Packaging Innovation Awards (PIA), a packaging industry accolade for recognizing breakthroughs in technological advancement, sustainability and enhanced user experience.
As one of the industry’s longest-running independently judged awards, the global program — now into its 35th edition — will be held in Asia-Pacific this year as the region plays host for the first time to both the judging event and awards ceremony.
PIA shines a spotlight on designs that demonstrate what packaging can be when industry talent harnesses creativity and technology to solve contemporary challenges across the complete packaging value chain.
The 2022 edition drew more than 180 packaging submissions from 30 countries, and 28 inspiring packaging solutions were recognized for their demonstrable excellence.
This edition marks the beginning of a new biennial format that provides a longer submission period to give participants more time to collaborate with relevant partners on building out a submission.
The submission period is now open and closes on March 8, 2024. Award finalists will be notified on August 28, 2024, with the awards ceremony set to take place in Tokyo, Japan in October 2024.
