Labelexpo Europe 2023 To Showcase Dieline Forum

The organizers of Labelexpo Global Series have announced a new exclusive forum, ‘The Dieline Forum’ taking place on September 11-12 as part of Labelexpo Europe 2023 at Brussels Expo, Brussels, Belgium.

Organized by Dieline, a global package design community, the two-day conference will reportedly bring together industry experts, and thought leaders to explore the latest trends, innovations, and sustainable advancements shaping the future of packaging design.  

The Dieline Forum will provide an opportunity for participants to take part in live discussions, gain invaluable knowledge and develop meaningful connections with leading design professionals. 

The discussions will explore topics such as the branding strategies and practices that are targeted toward Gen Z and Millennials to how brands are tapping into the power of sustainability. Keynote speakers include Jemma Wong of, Andreu Gadea of Lavernia & Cienfuegos, Jonas Andersson of Brand Union Stockholm, Jo Tulej of Mother Design, Matt Lurcock from Turner Duckworth, and Brandi Parker of Here Design.


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